Specification：

Style no.：

S3E-152324420-310-C17

Connector kind:

Type-C connector

Connector interface:

Female receptacle (socket)/Receptacle

USB Protocol/Version:

USB 3.2 Gen 2

PCB mount type:

Surface mount

Installation:

Horizontal

Pins:

24P

Welding process:

Dual rows SMT

Entry type:

Side

Mount position:

Top Mount

Contact material:

Copper alloy

Underplating:

50µ" Min. nickel all over

Metallic Shell:

Stainless steel

Contact Terminal:

Copper Alloy

Application:

Peripheral connectors for mobile phones, computers, cars, digital devices, communications, new energy, smart devices, etc.

High frequency data transmission rate

Compatible with USB 3.1, USB3.0 and USB 2.0 devices

High quality material and unique design

Support USB PD fast charging

Technical parameter:

Rated voltage:

5V

Rated current:

5A

Insertion and extraction force test:

10000 times

Salt spray test:

48H

Insulation resistance:

100mΩ Min

Contact resistance:

40mΩ Max

Temperature resistance on the board:

260℃

Operating Temperature

-25℃~+85℃

Certificate:

ROHS

REACH

Quality warranty term:

1 year

Specification:

Capacity:

4GB/8GB/16GB/32GB/64GB/128GB/256GB

Length:

15.1mm

Compatible with:

USB2.0/USB1.1

Nand flash chips kinds:

SLC/MLC/3D TLC

Nand flash chips grades:

Original and good die

Support:

USB HDD, USB ZIP dual boot mode

Function available:

Password protection function, auto-run function, bootable function, ReadyBoost function and data protection function

Compatible with:

Windows 98/ME, 2000/XP/Vista, Mac OS 9. X/X, Linux 2.4X or above versions

USB flash drive chip

With OTG gold finger

Smallest size

Dimension, nand flash chips and controllers can be customized

A new production method for USB flash drive

Flash chip is assembled on board together with controller, solution and accordingly software tackling

The assembled board can be used for whole USB flash drive function, also can be assembled in almost USB flash drive cases

Based on this production procedure, the defect ratio is pretty fewer and the quality is more stable than regular SMT production

Super thin and small size

Better water-proof and shock resistance function

Difficult fixed

Powered by USB bus directly

Hot plug & play

Shake protection

Technical parameter: 

Erase cycles:

1,000,000 times

Minimum data retention:

10 years

Operating Humidity:

20% - 90%

Storage Humidity:

20% - 93%

Storage temperature:

-20ºC to +55ºC

Operating temperature:

-10ºC to +55ºC

Shock resistance:

1,000 g

Certificate:

CE

FCC

ROHS

Quality warranty term:  

5 years

Specification:

Capacity:

8GB/16GB/32GB/64GB

SD card kinds:

Micro SDXC UHS-3 card

Usage:

Industrial extended

Nand flash chips kinds:

PSLC (3D TLC)

Nand flash chips grades:

Original and good die

Industrial special material to keep cards to work best in extremely cold and hot working temperature

Data and files in industrial extended cards well protected in extremely cold and hot temperature

PSLC (3D TLC) original flash chips

Strong compatibility controllers and solution

Industrial production procedure

Severe quality control and serious testing required

Support CPRM (Content Protection for Recordable Media) 

Support In System Programming (ISP) function to load the firmware  

Supports power down commands and sleep modes  

Low power consumption:  

Automatic power down and automatic wake up, smart power management 

Non-volatile storage and no battery required

Low weight

Noiseless

Low profile

Technical parameter: 

Humidity:  

8% to 95%, non-condensing 

MTBF: 

>1, 000, 000 hours 

Durability:

Minimum 10, 000 insertion/removal cycles

Voltage range for communication:     

2.0~3.6V

Voltage range for operating: 

2.7~3.6V

Variable clock rate:

0~25MHz

Storage temperature: 

-40°C ~ 85°C

Operating temperature: 

-40 ℃ - 85 ℃

Shock:

1, 000g/Max

Certificate:

CE

FCC

ROHS

Quality warranty term:  

5 years

Specification:

Capacity:

16GB/32GB/64GB/128GB/256GB/512GB

Sata interface:

Sata III

Form factor:

mSata

Nand flash chips kinds:

MLC

Nand flash chips grades:

Original and good die

Strong compatibility controllers and solution 

Industrial production procedure 

Severe quality control and serious testing required 

Supports Dynamic Power Management

S. M. A. R. T, NCQ, Trim and dynamic power management support

Quick Erase Function Optional

Static and dynamic wear-leveling

Supports Active and Passive Garbage Collection

Automatic error correction function (ECC)

Technical parameter: 

Humidity:  

10% ~ 95% (30°C Max. Wet Bulb Temp)

Power Requirement

DC 3.3V

Power Consumption (max.)

80 mA

Power Consumption (idle)

95 mA

Vibration: 

20g, 10 ~ 2000Hz

Drop:

75cm

Shock:     

1,500g@0.5ms

MTBF (est) @25°C: 

> 3,000,000 hrs

Storage temperature: 

-55°C ~ 95°C

Operating temperature: 

-40°C ~ 85°C

Certificate:

CE

FCC

ROHS

Quality warranty term:  

5 years

Specification:

Capacity:

8GB/16GB/32GB/64GB

Sata interface:

Sata III

Form factor:

mSata

Nand flash chips kinds:

SLC

Nand flash chips grades:

Original and good die

Strong compatibility controllers and solution 

Industrial production procedure 

Severe quality control and serious testing required 

Supports Dynamic Power Management

S. M. A. R. T, NCQ, Trim and dynamic power management support

Quick Erase Function Optional

Static and dynamic wear-leveling

Supports Active and Passive Garbage Collection

Automatic error correction function (ECC)

Technical parameter: 

Humidity:  

10% ~ 95% (30°C Max. Wet Bulb Temp)

Power Requirement

DC 3.3V

Power Consumption (max.)

400 mA

Power Consumption (idle)

95 mA

Vibration: 

20g, 10 ~ 2000Hz

Drop:

75cm

Shock:     

1,500g@0.5ms

MTBF (est) @25°C: 

> 3,000,000 hrs

Storage temperature: 

-55°C ~ 95°C

Operating temperature: 

-40°C ~ 85°C

Certificate:

CE

FCC

ROHS

Quality warranty term:  

5 years

Specification:

Capacity:

8GB/16GB/32GB/64GB

Sata interface:

Sata III

Form factor:

mSata

Nand flash chips kinds:

SLC

Nand flash chips grades:

Original and good die

Strong compatibility controllers and solution 

Industrial production procedure 

Severe quality control and serious testing required 

Supports Dynamic Power Management

S. M. A. R. T, NCQ, Trim and dynamic power management support

Quick Erase Function Optional

Static and dynamic wear-leveling

Supports Active and Passive Garbage Collection

Automatic error correction function (ECC)

Technical parameter: 

Humidity:  

10% ~ 95% (30°C Max. Wet Bulb Temp)

Power Requirement

DC 3.3V

Power Consumption (max.)

400 mA

Power Consumption (idle)

95 mA

Vibration: 

20g, 10 ~ 2000Hz

Drop:

75cm

Shock:     

1,500g@0.5ms

MTBF (est) @25°C: 

> 3,000,000 hrs

Storage temperature: 

-55°C ~ 95°C

Operating temperature: 

-20°C ~ 75°C:

Certificate:

CE

FCC

ROHS

Quality warranty term:  

5 years

Specification:

Capacity:

64GB/128GB/256GB/512GB

UFS protocol:

UFS2.2

M-PHY interface:

3.0

UniPro protocol:

1.6

Package:

BGA-153

Dimension:

11.5(L)x13.0(H)x1.0(W)mm

Nand flash chips grades:

Original and good die

Controller:

Customized controller

Strong compatibility controllers and solution 

Professional production procedure 

Severe quality control and serious testing required 

Technical parameter: 

Moisture Sensitivity Levels:  

MSL3

Voltage range for operating: 

VCC: 2.7~3.6

VCCQ2: 1.7~1.95

Storage temperature: 

-40 ºC - 80 ºC

Operating temperature: 

-25 ºC - 85 ºC

Certificate:

CE

FCC

ROHS

Quality warranty term:  

5 years