Welcome to Supertechina (Shanghai) Electronic Co., Ltd. We would like to support you in flash storage products, industrial flash storage produccts and professional customized flash storage solution & service.
Industrial extended MLC eMSD (embedded Micro SD card)
An eMSD is an embedded Micro SD card designed in an LGA-8 package form. The operation of eMSD is similar to an Micro SD card based on industry standard. An eMSD consists of an industrial standard nand flash chip and a high reliable controller.
eMSD is fully compliant with SD 3.0 interface which allows most of general CPU to utilize and provides high reliability, high quality and ultra-low power consumption at competitive cost.
Supertechina industrial regular MLC eMSD adopted original SLC nand flash chips and specific controllers which assures stable compatibility and quality. In addition, special materials are used in special hard situation in order to assure that memory card can be used in extremely hot and cold temperature.
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Specification: |
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Capacity: |
2GB/4GB/8GB |
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Compatible with: |
SD2.0 |
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Dimension: |
7.8(L)*6.2(W)*0.8(H) mm 7.8(L)*6.6(W)*0.8(H)mm 9.5(L)*7.5(W)*0.8(H)mm 10(L)*9(W)*0.8(H)mm |
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Protocol: |
SD |
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Nand flash chips kind: |
MLC |
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Nand flash chips grade: |
Original and good die |
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Fat: |
Fat32 |
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Package type: |
LAG-8 (Land Grid Array) |
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Controller: |
AX/SMI etc. |
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Class: |
C10/UHS-1/UHS-3 |
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SD/SPI mode supported |
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Strong compatibility controllers and solution |
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Industrial production procedure |
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Severe quality control and serious testing required |
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Compliant with Secure Digital Music Initiative (SDMI) |
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SD Memory Card protocol compatible |
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Support CPRM (Content Protection for Recordable Media) |
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Support Error Correcting Code (ECC) function to detect and correct errors |
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Support In System Programming (ISP) function to load the firmware |
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Supports power down commands and sleep modes |
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Low power consumption: Automatic power down and automatic wake up, smart power management |
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Non-volatile storage and no external programming voltage required |
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Low weight |
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Noiseless |
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Operating voltage: |
Basic communication (CMD0, CMD15, CMD55, ACMD41): 2.0 - 3.6V Other command and memory access: 2.7 - 3.6V |
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Humidity: |
25% ~ 85% |
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Operating temperature range: |
-40ºC to +85ºC |
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Storage temperature range: |
-40ºC to +85ºC |
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CE |
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FCC |
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ROHS |
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5 years |
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Industrial extended M.2 2280 PCIe Gen 4 * 4 NVMe SSD
Supertechina Industrial extended M.2 2280 PCIE Gen 4 * 4 NVMe SSD adopted original and good die MLC nand flash chips and specific controllers which assured stable and high compatibility. In addition, special materials are used in special hard situation in order to assure that memory card can be used in extremely hot and cold temperature.
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Specification: |
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Capacity: |
128GB/256GB/512GB/1TB/2TB/4TB |
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Dimension: |
80(L)*22(W)*3.5(H)mm |
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Interface: |
PCIe Gen4x4, NVMe |
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Form factor: |
M.2 2280 (80mm) |
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Nand flash chips kinds: |
3D TLC |
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Nand flash chips grades: |
Original and good die |
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Support LDPC ECC Error Correction and Correction Mechanism |
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Global Wear Leveling |
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Fast Flash Memory Bad Block Management |
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End-to-end data protection technology |
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Fast Flash Translation Layer: Page Mapping |
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High reading and writing speed |
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Support SSDWidget functionality |
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Support for the TRIM command |
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Hyper Cache Fast Retrieval Technology |
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S.M.A.R.T. |
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Can operate stably in environments with high vibration and extreme temperature fluctuations |
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NVMe Secure Erase |
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Voltage: |
DC 3.3V |
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Operating Temperature: |
-40º C to 85º C |
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Storage Temperature: |
-55º C to 85º C |
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Humidity: |
10% ~ 95% (30°C Max. Wet Bulb Temp) |
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Power Consumption (Max.): |
5000 mA |
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Power Consumption (Idle) |
850 mA |
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MTBF: |
>3,000,000 hrs |
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Vibration: |
20G p-p, 80~2000Hz |
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Shock: |
1,500G @ 0.5ms |
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Drop: |
75 cm |
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CE |
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FCC |
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ROHS |
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5 years |
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Industrial extended eMMC 5.1
Supertechina industrial extended eMMC adopted high graded nand flash chips and latest controllers to assure good quality, high reliability, high PE, and high-performance and can be compatibility with mobile phone, car navigators and other professional equipment and can work in severe cold and hot harsh environment.
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Specification: |
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Capacity: |
8GB/16GB/32GB/64GB/128GB |
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Compatible with: |
JEDEC/MMC standard version 5.1-compliant Backward compatible to eMMC v4.5 to v5.1 |
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Dimension: |
11.5(L)*13(W)*1.0(H)mm |
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Nand flash chips kind: |
PSLC, 3D TLC |
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Nand flash chips grade: |
Original and good die |
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Package type: |
153 FBGA |
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Reading speed: |
- Over 270MB/s |
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Writing speed: |
- Over 150MB/s |
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Support Single Data Rate (SDR) and Dual Data Rate (DDR) |
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Original Boot and Alternative Boot modes |
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Hardware reset signal |
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Data Removal commands: Erase, Trim, Sanitize and Discard |
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Multiple Partitioning |
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Signed access to a Replay Protected Memory Block |
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Replay Protected Memory Block (RPMB) |
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Lock/Unlock and Write Protection |
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Data protection mechanisms: Password/Permanent/Power-on/Temporary |
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Support Sleep/Awake |
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Power off notification |
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Operating voltage: |
VCC = 2.7–3.6V VCCQ = 1.7–1.95V / 2.7–3.6V |
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Data bus width: |
1-bit (default), 4-bit, 8-bit |
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Operating temperature range: |
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Storage temperature range: |
-40ºC to +85ºC |
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HS400/Clock frequencies: |
0~200MHz |
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CE |
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FCC |
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ROHS |
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5 years |
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Industrial regular Micro UDP USB2.0 flash drive chip with OTG gold finger
Supertechina UDP USB flash drive chip is very slim and short and can be assembled in very short and small USB flash drive cases. UDP USB flash drive chip is more stable in quality than traditional USB flash drive based on new production skills. Supertechina UDP USB flash drive chip can be customized for dimension and also choose different nand flash chips & controllers.
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Specification: |
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Capacity: |
4GB/8GB/16GB/32GB/64GB/128GB/256GB |
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Length: |
15.1mm |
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Compatible with: |
USB2.0/USB1.1 |
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Nand flash chips kinds: |
SLC/MLC/3D TLC |
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Nand flash chips grades: |
Original and good die |
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Support: |
USB HDD, USB ZIP dual boot mode |
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Function available: |
Password protection function, auto-run function, bootable function, ReadyBoost function and data protection function |
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Compatible with: |
Windows 98/ME, 2000/XP/Vista, Mac OS 9. X/X, Linux 2.4X or above versions |
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USB flash drive chip |
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With OTG gold finger |
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Smallest size |
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Dimension, nand flash chips and controllers can be customized |
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A new production method for USB flash drive |
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Flash chip is assembled on board together with controller, solution and accordingly software tackling |
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The assembled board can be used for whole USB flash drive function, also can be assembled in almost USB flash drive cases |
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Based on this production procedure, the defect ratio is pretty fewer and the quality is more stable than regular SMT production |
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Super thin and small size |
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Better water-proof and shock resistance function |
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Difficult fixed |
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Powered by USB bus directly |
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Hot plug & play |
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Shake protection |
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Erase cycles: |
1,000,000 times |
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Minimum data retention: |
10 years |
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Operating Humidity: |
20% - 90% |
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Storage Humidity: |
20% - 93% |
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Storage temperature: |
-20ºC to +55ºC |
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Operating temperature: |
-10ºC to +55ºC |
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Shock resistance: |
1,000 g |
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CE |
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FCC |
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ROHS |
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5 years |
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USB3.2 Gen2, Receptacle, Dual Row SMT, Horizontal, PCB top mount, 24Pin, type C connector
Supertechina USB3.2 Gen2, Receptacle, Dual Row SMT, Horizontal, PCB top mount, 24Pin, type C connector uses imported high-end raw materials and adopts a unique design that assured high standard connectors. The product has excellent quality and can be used for peripheral connectors such as mobile phones, computers, automobiles, digital devices, communications, new energy, and smart devices.
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Specification: |
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Style no.: |
S3E-152324420-310-C17 |
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Connector kind: |
Type-C connector |
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Connector interface: |
Female receptacle (socket)/Receptacle |
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USB Protocol/Version: |
USB 3.2 Gen 2 |
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PCB mount type: |
Surface mount |
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Installation: |
Horizontal |
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Pins: |
24P |
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Welding process: |
Dual rows SMT |
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Entry type: |
Side |
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Mount position: |
Top Mount |
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Contact material: |
Copper alloy |
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Underplating: |
50µ" Min. nickel all over |
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Metallic Shell: |
Stainless steel |
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Contact Terminal: |
Copper Alloy |
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Application: |
Peripheral connectors for mobile phones, computers, cars, digital devices, communications, new energy, smart devices, etc. |
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High frequency data transmission rate |
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Compatible with USB 3.1, USB3.0 and USB 2.0 devices |
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High quality material and unique design |
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Support USB PD fast charging |
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Technical parameter: |
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Rated voltage: |
5V |
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Rated current: |
5A |
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Insertion and extraction force test: |
10000 times |
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Salt spray test: |
48H |
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Insulation resistance: |
100mΩ Min |
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Contact resistance: |
40mΩ Max |
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Temperature resistance on the board: |
260℃ |
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Operating Temperature |
-25℃~+85℃ |
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Certificate: |
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ROHS |
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REACH |
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Quality warranty term: |
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1 year |
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Industrial regular Micro UDP USB2.0 flash drive chip with OTG gold finger
Supertechina UDP USB flash drive chip is very slim and short and can be assembled in very short and small USB flash drive cases. UDP USB flash drive chip is more stable in quality than traditional USB flash drive based on new production skills. Supertechina UDP USB flash drive chip can be customized for dimension and also choose different nand flash chips & controllers.
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Specification: |
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Capacity: |
4GB/8GB/16GB/32GB/64GB/128GB/256GB |
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Length: |
15.1mm |
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Compatible with: |
USB2.0/USB1.1 |
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Nand flash chips kinds: |
SLC/MLC/3D TLC |
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Nand flash chips grades: |
Original and good die |
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Support: |
USB HDD, USB ZIP dual boot mode |
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Function available: |
Password protection function, auto-run function, bootable function, ReadyBoost function and data protection function |
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Compatible with: |
Windows 98/ME, 2000/XP/Vista, Mac OS 9. X/X, Linux 2.4X or above versions |
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USB flash drive chip |
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With OTG gold finger |
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Smallest size |
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Dimension, nand flash chips and controllers can be customized |
|
|
A new production method for USB flash drive |
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|
Flash chip is assembled on board together with controller, solution and accordingly software tackling |
|
|
The assembled board can be used for whole USB flash drive function, also can be assembled in almost USB flash drive cases |
|
|
Based on this production procedure, the defect ratio is pretty fewer and the quality is more stable than regular SMT production |
|
|
Super thin and small size |
|
|
Better water-proof and shock resistance function |
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|
Difficult fixed |
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Powered by USB bus directly |
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Hot plug & play |
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Shake protection |
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Erase cycles: |
1,000,000 times |
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Minimum data retention: |
10 years |
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Operating Humidity: |
20% - 90% |
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Storage Humidity: |
20% - 93% |
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Storage temperature: |
-20ºC to +55ºC |
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Operating temperature: |
-10ºC to +55ºC |
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Shock resistance: |
1,000 g |
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CE |
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FCC |
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ROHS |
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5 years |
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Industrial extended PSLC (3D) Micro SDXC UHS-3 card
Supertechina extended PSLC (3D TLC) Micro SDXC UHS-3 card adopted original and good die 3D TLC nand flash chips that simulates the characters of SLC nand flash chips and specific controllers which assured stable and high compatibility. In addition, special materials are used in special hard situation in order to assure that memory card can be used in extremely hot and cold temperature.
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Specification: |
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Capacity: |
8GB/16GB/32GB/64GB |
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SD card kinds: |
Micro SDXC UHS-3 card |
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Usage: |
Industrial extended |
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Nand flash chips kinds: |
PSLC (3D TLC) |
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Nand flash chips grades: |
Original and good die |
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Industrial special material to keep cards to work best in extremely cold and hot working temperature |
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Data and files in industrial extended cards well protected in extremely cold and hot temperature |
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PSLC (3D TLC) original flash chips |
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Strong compatibility controllers and solution |
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Industrial production procedure |
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Severe quality control and serious testing required |
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Support CPRM (Content Protection for Recordable Media) |
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Support In System Programming (ISP) function to load the firmware |
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Supports power down commands and sleep modes |
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Low power consumption: |
Automatic power down and automatic wake up, smart power management |
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Non-volatile storage and no battery required |
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Low weight |
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Noiseless |
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Low profile |
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Humidity: |
8% to 95%, non-condensing |
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MTBF: |
>1, 000, 000 hours |
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Durability: |
Minimum 10, 000 insertion/removal cycles |
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Voltage range for communication: |
2.0~3.6V |
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Voltage range for operating: |
2.7~3.6V |
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Variable clock rate: |
0~25MHz |
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Storage temperature: |
-40°C ~ 85°C |
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Operating temperature: |
-40 ℃ - 85 ℃ |
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Shock: |
1, 000g/Max |
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CE |
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FCC |
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ROHS |
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5 years |
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Industrial extended MLC mSata III SSD
Supertechina industrial MLC mSata III SSD adopted original and good die MLC nand flash chips and specific controllers which assured stable and high compatibility.
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Specification: |
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Capacity: |
16GB/32GB/64GB/128GB/256GB/512GB |
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Sata interface: |
Sata III |
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Form factor: |
mSata |
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Nand flash chips kinds: |
MLC |
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Nand flash chips grades: |
Original and good die |
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Strong compatibility controllers and solution |
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Industrial production procedure |
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Severe quality control and serious testing required |
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Supports Dynamic Power Management |
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S. M. A. R. T, NCQ, Trim and dynamic power management support |
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Quick Erase Function Optional |
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Static and dynamic wear-leveling |
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Supports Active and Passive Garbage Collection |
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Automatic error correction function (ECC) |
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Humidity: |
10% ~ 95% (30°C Max. Wet Bulb Temp) |
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Power Requirement |
DC 3.3V |
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Power Consumption (max.) |
80 mA |
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Power Consumption (idle) |
95 mA |
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Vibration: |
20g, 10 ~ 2000Hz |
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Drop: |
75cm |
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Shock: |
1,500g@0.5ms |
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MTBF (est) @25°C: |
> 3,000,000 hrs |
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Storage temperature: |
-55°C ~ 95°C |
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Operating temperature: |
-40°C ~ 85°C |
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CE |
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FCC |
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ROHS |
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5 years |
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Industrial extended SLC mSata III SSD
Supertechina industrial SLC mSata III SSD adopted original and good die SLC nand flash chips and specific controllers which assured stable and high compatibility.
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Specification: |
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Capacity: |
8GB/16GB/32GB/64GB |
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Sata interface: |
Sata III |
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Form factor: |
mSata |
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Nand flash chips kinds: |
SLC |
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Nand flash chips grades: |
Original and good die |
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Strong compatibility controllers and solution |
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Industrial production procedure |
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Severe quality control and serious testing required |
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Supports Dynamic Power Management |
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S. M. A. R. T, NCQ, Trim and dynamic power management support |
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Quick Erase Function Optional |
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Static and dynamic wear-leveling |
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Supports Active and Passive Garbage Collection |
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Automatic error correction function (ECC) |
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Humidity: |
10% ~ 95% (30°C Max. Wet Bulb Temp) |
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Power Requirement |
DC 3.3V |
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Power Consumption (max.) |
400 mA |
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Power Consumption (idle) |
95 mA |
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Vibration: |
20g, 10 ~ 2000Hz |
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Drop: |
75cm |
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Shock: |
1,500g@0.5ms |
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MTBF (est) @25°C: |
> 3,000,000 hrs |
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Storage temperature: |
-55°C ~ 95°C |
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Operating temperature: |
-40°C ~ 85°C |
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CE |
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FCC |
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ROHS |
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5 years |
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Industrial regular MLC mSata III SSD
Supertechina industrial MLC mSata III SSD adopted original and good die MLC nand flash chips and specific controllers which assured stable and high compatibility.
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Specification: |
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Capacity: |
16GB/32GB/64GB/128GB/256GB/512GB |
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Sata interface: |
Sata III |
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Form factor: |
mSata |
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Nand flash chips kinds: |
MLC |
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Nand flash chips grades: |
Original and good die |
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Strong compatibility controllers and solution |
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Industrial production procedure |
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Severe quality control and serious testing required |
|
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Supports Dynamic Power Management |
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|
S. M. A. R. T, NCQ, Trim and dynamic power management support |
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Quick Erase Function Optional |
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Static and dynamic wear-leveling |
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Supports Active and Passive Garbage Collection |
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Automatic error correction function (ECC) |
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Humidity: |
10% ~ 95% (30°C Max. Wet Bulb Temp) |
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Power Requirement |
DC 3.3V |
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Power Consumption (max.) |
80 mA |
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Power Consumption (idle) |
95 mA |
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Vibration: |
20g, 10 ~ 2000Hz |
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Drop: |
75cm |
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Shock: |
1,500g@0.5ms |
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MTBF (est) @25°C: |
> 3,000,000 hrs |
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Storage temperature: |
-55°C ~ 95°C |
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Operating temperature: |
-20°C ~ 75°C: |
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CE |
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FCC |
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ROHS |
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5 years |
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